Thermal interface material is used to fill the gaps between thermal transfer surfaces, such as between microprocessors and heat sinks, in order to increase thermal transfer efficiency. These gaps are normally filled with air which is a very poor conductor. The material is easy to handle and is not messy. It is available in solid and liquid form and in various thicknesses.
热界面材料被用于在热传输面之间填充裂隙，如在微处理器和散热器之间，为了增加热转换效率。这些裂隙通常被填充空气，这是个非常不良的导体。该材料是非常容易操作的，是不肮脏的。它是可用以固体和液体形式，以各种不同的厚度。

Thermal conductivity热导率
The thermal conductivity of the interface material has a significant impact on its thermal performance. The high thermal conductivity guarantees sufficient heat transfer, resulting in a better cooling solution and the desired heat dissipation.
界面材料的热导率在它的热特性上有一个重要的影响。高的热导率确保充分的热传输，导致一个更好的冷却解决和得到理想的热耗散。

Properties特性

1. Good insulation properties好的绝缘性能
2. Heat-conducting热传导的
3. Good compressibility好的压缩率
4. Flexible柔软的
5. Environmentally friendly利于环境保护的

Benefits好处

1. Smooth surface平滑表面
2. Very good thermal transfer properties even at very low contact pressure非常好的热转移特性，即使在非常低的接触压力。
3. Low hardness低硬度
4. High self-adhesion高的自粘作用
5. UL listed列表
6. Thickness 0.01 to 8 mm厚度

This film is especially suitable for high-power applications.这个薄片是非常适合于高功率的应用。
It has excellent thermal and electrical properties.它有卓越的热和电特性。
Thanks to its good performance, the material can be used reliably in densely packed electronic applications.由于它的良好性能，该材料能被可靠地使用在密集的装配电子应用方面。

Standard part numbers标准零件号